The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Dec. 18, 2018
Alpha and Omega Semiconductor (Cayman) Ltd., Grand Cayman, KY;
Xiaotian Zhang, San Jose, CA (US);
Yan Xun Xue, Los Gatos, CA (US);
Long-Ching Wang, Cupertino, CA (US);
Yueh-Se Ho, Sunnyvale, CA (US);
Zhiqiang Niu, Santa Clara, CA (US);
ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD. GRAND, Grand Cayman, KY;
Abstract
A semiconductor package has a plurality of pillars or portions of a plurality of lead strips, a plurality of semiconductor devices, one or two molding encapsulations and a plurality of electrical interconnections. The semiconductor package excludes a wire. The semiconductor package excludes a clip. A method is applied to fabricate semiconductor packages. The method includes providing a removable carrier; forming a plurality of pillars or a plurality of lead strips; attaching a plurality of semiconductor devices; forming one or two molding encapsulations; forming a plurality of electrical interconnections and removing the removable carrier. The method may further include a singulation process.