The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Feb. 27, 2020
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Susmit Singha Roy, Mountain View, CA (US);
Yihong Chen, San Jose, CA (US);
Abhijit Basu Mallick, Fremont, CA (US);
Srinivas Gandikota, Santa Clara, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76852 (2013.01); H01L 21/0217 (2013.01); H01L 21/0228 (2013.01); H01L 21/0234 (2013.01); H01L 21/02178 (2013.01); H01L 21/02211 (2013.01); H01L 21/02274 (2013.01); H01L 21/02315 (2013.01); H01L 21/31053 (2013.01); H01L 21/324 (2013.01); H01L 21/76864 (2013.01);
Abstract
In one embodiment, a method of forming a barrier layer is provided. The method includes positioning a substrate in a processing chamber, forming a barrier layer over the substrate and in contact with the underlayer, and annealing the substrate. The substrate comprises at least one underlayer having cobalt, tungsten, or copper. The barrier layer has a thickness of less than 70 angstroms.