The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

Dec. 01, 2017
Applicants:

Melexis Technologies NV;

X-celeprint Limited, Dublin, IE;

Inventors:

Christian Schott, Lussy-sur-Morges, CH;

Matthew Meitl, Durham, NC (US);

Christopher Bower, Raleigh, NC (US);

Assignees:

MELEXIS TECHNOLOGIES NV, Tessenderlo, BE;

X-CELEPRINT LIMITED, Dublin, IE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 33/00 (2006.01); G01R 33/07 (2006.01); G01R 33/09 (2006.01); H01L 23/00 (2006.01); H01L 43/04 (2006.01); G01R 15/20 (2006.01);
U.S. Cl.
CPC ...
G01R 33/0047 (2013.01); G01R 33/0052 (2013.01); G01R 33/0094 (2013.01); G01R 33/07 (2013.01); G01R 33/077 (2013.01); G01R 33/09 (2013.01); G01R 33/093 (2013.01); G01R 33/098 (2013.01); H01L 24/00 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 24/94 (2013.01); H01L 43/04 (2013.01); G01R 15/207 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/92137 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/181 (2013.01);
Abstract

A multi-element sensor for measuring a magnetic field. The multi-element sensor comprises a magnetic sensing element, and an electronic circuit. The magnetic sensing element is mounted on the electronic circuit and comprises a fractured tether. The magnetic sensing element is electrically connected with the electronic circuit. The electronic circuit is produced in a first technology and/or first material and the magnetic sensing element is produced in a second technology and/or second material different from the first technology/material.


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