The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
May. 02, 2017
Applicant:
Korea Institute of Energy Research, Daejeon, KR;
Inventors:
Bo-Yun Jang, Daejeon, KR;
Joon-Soo Kim, Daejeon, KR;
Hui-Chan Moon, Daejeon, KR;
Sun-Ho Choi, Gongju-si, KR;
Assignee:
KOREA INSTITUTE OF ENERGY RESEARCH, Daejeon, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28D 5/04 (2006.01); B23H 1/08 (2006.01); B23H 7/38 (2006.01); B23Q 11/12 (2006.01); B23Q 11/14 (2006.01); B26D 3/28 (2006.01); B26D 7/27 (2006.01); B28D 5/00 (2006.01); B23H 9/00 (2006.01); B23H 7/02 (2006.01); C10N 40/06 (2006.01); C10N 40/22 (2006.01);
U.S. Cl.
CPC ...
B28D 5/045 (2013.01); B23H 1/08 (2013.01); B23H 7/38 (2013.01); B23Q 11/122 (2013.01); B23Q 11/145 (2013.01); B26D 3/28 (2013.01); B26D 7/27 (2013.01); B28D 5/0058 (2013.01); B23H 7/02 (2013.01); B23H 9/00 (2013.01); C10N 2040/06 (2013.01); C10N 2040/22 (2013.01);
Abstract
Provided are a silicon ingot slicing apparatus capable of slicing silicon ingots in various forms such as blocks or wafers using microbubbles and wire electric discharge machining.
Jang, Bo-Yun. (2021). Silicon ingot slicing apparatus using microbubbles and wire electric discharge machining (U.S. Patent No. 11065783). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11065783
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile