Sun-Ho Choi

Title: Sun-Ho Choi: Innovator in Silicon Slicing Technology

Introduction

Sun-Ho Choi is a prominent inventor based in Gongju-si, South Korea. He has made significant contributions to the field of silicon slicing technology, holding 2 patents that showcase his innovative approach to enhancing manufacturing processes.

Latest Patents

His latest patents include a "Silicon ingot slicing apparatus using microbubbles and wire electric discharge machining." This invention provides a method for slicing silicon ingots into various forms, such as blocks or wafers, utilizing microbubbles and wire electric discharge machining. Another notable patent is the "Silicon wafer slicing device using wire discharge machining." This apparatus is designed to cut silicon ingots to fabricate silicon wafers, specifically employing wire discharge machining. The invention features a water tank containing an electrolyte, a cutting wire, an ingot transferring unit, an electrolyte circulating means, and a power supply unit, all working together to enhance the efficiency of the slicing process.

Career Highlights

Sun-Ho Choi is affiliated with the Korea Institute of Energy Research, where he continues to develop and refine his innovative technologies. His work has significantly impacted the efficiency and effectiveness of silicon wafer production.

Collaborations

He has collaborated with notable colleagues, including Bo-Yun Jang and Joon-Soo Kim, contributing to advancements in their respective fields.

Conclusion

Sun-Ho Choi's contributions to silicon slicing technology exemplify the spirit of innovation. His patents reflect a commitment to improving manufacturing processes, making him a key figure in the industry.