The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Sep. 04, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Injo Ok, Loudonville, NY (US);
Balasubramanian Pranatharthiharan, Watervliet, NY (US);
Wei Wang, Yorktown Heights, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 45/00 (2006.01); H01L 21/764 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 45/1293 (2013.01); H01L 45/06 (2013.01); H01L 45/1253 (2013.01); H01L 45/144 (2013.01); H01L 45/1616 (2013.01); H01L 21/764 (2013.01); H01L 21/76832 (2013.01); H01L 23/5329 (2013.01);
Abstract
A method is presented for reducing heat loss to adjacent semiconductor structures. The method includes forming a plurality of conductive lines within an interlayer dielectric, forming a barrier layer over at least one conductive line of the plurality of conductive lines, forming a via extending to a top surface of the barrier layer, and defining dual air gaps within the via and over the barrier layer.