The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Feb. 20, 2020
Nanya Technology Corporation, New Taipei, TW;
Chia-Lin Tsai, Chiayi, TW;
Mao-Ying Wang, New Taipei, TW;
NANYA TECHNOLOGY CORPORATION, New Taipei, TW;
Abstract
A chip includes pads having first connecting surfaces, and conductive structures located on the first connecting surfaces. The conductive structures are disposed on the first connecting surfaces. Each of the conductive structures includes first metal layer, second metal layer, and third metal layer. The first metal layer connects one of the pads, and the second metal layer is disposed between the first metal layer and the third metal layer. On every pad, the first metal layer, the second metal layer, and the third metal layer are stacked along first direction on the first connecting surface of the pad, and the first direction is parallel to normal direction of the first connecting surface, and the first metal layer is made of material comprising gold, and the second metal layer is made of material comprising nickel. A wafer is also provided.