The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Dec. 29, 2017
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Makoto Shibuya, Beppu, JP;
Daiki Komatsu, Beppu, JP;
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 21/4803 (2013.01); H01L 21/4842 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 23/3121 (2013.01); H01L 23/49503 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 23/49586 (2013.01); H01L 23/49861 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01);
Abstract
Leadframes, integrated circuit packaging with wettable flanks, and methods of manufacturing the same are disclosed. An example packaged device having a leadframe includes a die pad and a lead spaced apart from the die pad. The lead has a proximal end adjacent the die pad and a distal end extending away from the die pad. The lead has a thickness at the distal end that is less than a full thickness of the leadframe between a first outer surface on a die attach side of the leadframe and a second outer surface on a mounting side of the leadframe.