The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Jun. 03, 2020
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Ming-Yen Weng, Miao-Li County, TW;

Ker-Yih Kao, Miao-Li County, TW;

Chia-Chi Ho, Miao-Li County, TW;

Tsutomu Shinozaki, Miao-Li County, TW;

Cheng-Chi Wang, Miao-Li County, TW;

I-Yin Li, Miao-Li County, TW;

Assignee:

INNOLUX CORPORATION, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/48 (2006.01); H01Q 1/38 (2006.01); H01L 23/485 (2006.01); H01L 21/311 (2006.01); H01L 25/065 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/485 (2013.01); H01L 21/311 (2013.01); H01L 21/4814 (2013.01); H01L 23/66 (2013.01); H01L 25/0655 (2013.01); H01Q 1/38 (2013.01);
Abstract

A high-frequency device manufacturing method is provided. The method includes providing a substrate; forming a conductive material on the substrate; standing the substrate and the conductive material for a first time duration; forming a conductive layer by sequentially repeating the steps of forming the conductive material and standing at least once; and patterning the conductive layer. The thickness of the conductive layer is in a range from 0.9 μm to 10 μm. A high-frequency device is also provided.


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