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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11062923 B1

PDFFull Text
Date of Patent:
Jul. 13, 2021

Filed:

Sep. 28, 2018

Apparatus to control transfer parameters during transfer of semiconductor devices

Applicant:

Rohinni, Llc, Coeur d'Alene, ID (US);

Inventors:

Justin Wendt, Post Falls, ID (US);

Cody Peterson, Hayden, ID (US);

Andrew Huska, Liberty Lake, WA (US);

Assignee:

Rohinni, LLC, Coeur d'Alene, ID (US);

Attorney:

Lee & Hayes, P.C.

Primary Examiner:

Thiem D Phan

Int. Cl.
CPC ...
B23P 19/00 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/677 (2006.01); H01L 23/00 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); H01L 21/677 (2013.01); H01L 21/67144 (2013.01); H01L 21/6836 (2013.01); H01L 24/75 (2013.01); H01L 33/48 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68386 (2013.01); H01L 2224/75262 (2013.01); H01L 2224/75303 (2013.01); H01L 2224/75804 (2013.01); H01L 2224/75824 (2013.01); Y10T 29/53174 (2015.01);
Abstract

An apparatus includes a transfer mechanism to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace on a product substrate. The transfer mechanism includes one or more transfer wires. Two or more stabilizers disposed on either side of the one or more transfer wires. A needle actuator is connected to the one or more transfer wires and the two or more stabilizers to move the one or more transfer wires and the two or more stabilizers to a die transfer position.

Find Patent Forward Citations

Wendt, Justin. (2021). Apparatus to control transfer parameters during transfer of semiconductor devices (U.S. Patent No. 11062923). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11062923

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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