The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Apr. 25, 2017
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Naoyuki Nojiri, Tokyo, JP;
Hisato Takahashi, Tokyo, JP;
Makoto Kunimi, Tokyo, JP;
Kohji Hori, Tokyo, JP;
Assignee:
SHOWA DENKO MATERIALS CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08K 5/5415 (2006.01); C08L 83/04 (2006.01); C08G 77/04 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); C08G 59/42 (2006.01); C08G 59/40 (2006.01); C08L 33/06 (2006.01); C08L 33/12 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/4085 (2013.01); C08G 59/4253 (2013.01); C08G 77/04 (2013.01); C08K 5/5415 (2013.01); C08L 33/068 (2013.01); C08L 33/12 (2013.01); C08L 83/04 (2013.01); H01L 23/29 (2013.01); H01L 23/293 (2013.01); H01L 23/295 (2013.01); H01L 23/296 (2013.01); H01L 23/31 (2013.01); C08L 2203/206 (2013.01); C08L 2205/03 (2013.01); C08L 2205/22 (2013.01); C08L 2207/53 (2013.01);
Abstract
A liquid epoxy resin composition for sealing includes an epoxy resin, a curing agent, and a particle having a core-shell structure. In the composition, the particle having a core-shell structure includes a core including a cross-linked polysiloxane and a shell including a polymer in which the content of a structural unit having an epoxy group is 10% by mass or more.