The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Nov. 26, 2019
Applicants:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Senju System Technology Co., Ltd., Toyama, JP;
Inventors:
Noboru Hashimoto, Toyama, JP;
Takahiro Kasama, Toyama, JP;
Assignees:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
SENJU SYSTEM TECHNOLOGY CO., LTD., Toyama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 1/08 (2006.01);
U.S. Cl.
CPC ...
B23K 1/08 (2013.01);
Abstract
To provide a soldering method and a soldering apparatus which are capable of preheating a mask without degrading throughput. Provided is a soldering method including preheating a mask on which a substrate is not placed, placing the substrate on the preheated mask, and bringing at least a part of the substrate placed on the preheated mask into contact with molten solder and thus soldering the substrate.