The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Aug. 20, 2019
Applicant:

Unimicron Technology Corp., Taoyuan, TW;

Inventor:

Chien-Chen Lin, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/32 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/32 (2013.01); H05K 1/185 (2013.01); H05K 3/4682 (2013.01); H05K 1/11 (2013.01); H05K 1/18 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/1469 (2013.01); H05K 2203/167 (2013.01);
Abstract

A circuit board structure includes a circuit layer structure, an electronic component, and a stopper. The circuit layer structure includes a plurality of dielectric layers and circuits in the dielectric layers. The electronic component is disposed in the circuit layer structure; the electronic component includes a chip and a conductive bump; the chip has a first surface and a second surface that are oppositely disposed, and the first surface of the chip contacts one of the dielectric layers; the conductive bump is on the second surface of the chip and is electrically connected to the chip. The stopper is within the circuit layer structure and abuts against the conductive bump. A method for fabricating a circuit board structure is also provided herein.


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