The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Nov. 20, 2019
Applicant:
At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventor:
Jeesoo Mok, Chongqing, CN;
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 1/05 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); G03F 7/26 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 3/027 (2013.01); H05K 1/0204 (2013.01); H05K 1/05 (2013.01); H05K 1/115 (2013.01); H05K 1/186 (2013.01); H05K 3/007 (2013.01); H05K 3/0026 (2013.01); H05K 3/4038 (2013.01); H05K 3/4644 (2013.01); G03F 7/20 (2013.01); G03F 7/26 (2013.01); H05K 2203/107 (2013.01);
Abstract
A method of manufacturing a component carrier is disclosed. The method includes forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; patterning a front side of the stack using a first photo-imageable dielectric; and patterning a back side of the stack. A component carrier is also disclosed.