The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Apr. 02, 2020
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventor:

Hirokazu Yoshino, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H05K 1/115 (2013.01); H05K 3/4007 (2013.01); H05K 3/4644 (2013.01); H05K 3/4697 (2013.01); H05K 2201/10015 (2013.01); H05K 2203/107 (2013.01);
Abstract

A component-embedded substrate includes: a buildup layer including an insulating resin layer and a conductor layer; a cavity that is formed in the buildup layer; an electronic component that is mounted on a bottom face of the cavity through an adhesive layer; a pedestal that is disposed on the bottom face of the cavity so as to be opposed to four corners of the electronic component; and a filling resin layer that is filled into the cavity to cover the electronic component and the pedestal.


Find Patent Forward Citations

Yoshino, Hirokazu. (2021). Component-embedded substrate (U.S. Patent No. 11058006). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11058006

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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