The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Jan. 28, 2019
Applicant:
At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventors:
Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/46 (2006.01); H01L 23/538 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H05K 1/05 (2006.01); H05K 3/30 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H01L 23/13 (2013.01); H01L 23/3114 (2013.01); H01L 23/3121 (2013.01); H01L 23/5389 (2013.01); H05K 1/053 (2013.01); H05K 1/185 (2013.01); H05K 3/301 (2013.01); H05K 3/4697 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/18 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/8203 (2013.01); H01L 2224/9222 (2013.01); H05K 3/0035 (2013.01); H05K 2203/1469 (2013.01);
Abstract
A method of manufacturing a component carrier is presented. The method includes providing a base structure having a front side and a back side, the back side being at least partially covered by a metallic layer, removing material of the base structure from the front side to thereby form a cavity which is at least partially closed by the metallic layer, inserting a component in the cavity and placing the component on the metallic layer.