The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

May. 30, 2018
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Kevin G. Werhane, Kuna, ID (US);

Nathaniel J. Meier, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/317 (2006.01); H01L 21/00 (2006.01); G09G 1/00 (2006.01);
U.S. Cl.
CPC ...
G01R 31/31713 (2013.01); G01R 31/31707 (2013.01);
Abstract

Methods, systems, and devices for testing a die using a segmented digital die ring are described. A segmented digital die ring may include multiple signal line segments, each coupled with a test segment circuit, and a control circuit. A test segment circuit may generate a digital feedback signal that indicates a condition of a respective signal line segment. The control circuit may generate a single output signal, indicative of the condition of the signal line segments. By utilizing digital testing circuitry and a single digital output signal, a layout area of the segmented digital die ring be minimized and a power consumption associated with the testing operation may be reduced.


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