The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Sep. 29, 2015
Applicant:

Japan Science and Technology Agency, Kawaguchi, JP;

Inventors:

Yoko Yamanishi, Tokyo, JP;

Yohei Hamano, Tokyo, JP;

Takuya Kambayashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C12M 1/42 (2006.01); B05B 17/06 (2006.01); A61B 18/00 (2006.01); C12N 13/00 (2006.01); C12N 15/89 (2006.01); A61B 18/14 (2006.01);
U.S. Cl.
CPC ...
C12M 35/04 (2013.01); A61B 18/14 (2013.01); B05B 17/0607 (2013.01); C12M 35/00 (2013.01); C12M 35/02 (2013.01); C12N 13/00 (2013.01); C12N 15/89 (2013.01); A61B 2018/00577 (2013.01); A61B 2018/00964 (2013.01);
Abstract

The present invention enables fabrication and mass production of a bubble-jetting chip that includes a desired number of bubble jetting portions of the same size having bubble-jetting outlets of the same size. Mass production is enabled by fabricating a bubble-jetting chip comprising a substrate and a bubble-jetting portion formed on the substrate, the bubble-jetting portion comprising: an electrode that is formed of a conductive material; an insulating portion that is formed of an insulating photosensitive resin, is provided so as to sandwich the electrode, and includes an extended section that extends beyond the tip of the electrode; and a space that is formed between the extended section of the insulating portion and the tip of the electrode.


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