The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2021

Filed:

Sep. 09, 2019
Applicant:

Lite-on Singapore Pte. Ltd., Singapore, SG;

Inventors:

Suresh Basoor Nijaguna, Singapore, SG;

Guo-Jun Xu, Singapore, SG;

Kun-Lung Lee, New Taipei, TW;

Sin-Heng Lim, Singapore, SG;

Teck-Chai Goh, Singapore, SG;

Yu-Chou Lin, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/12 (2006.01); H01L 33/52 (2010.01); H01L 33/58 (2010.01); H01L 31/0203 (2014.01); H01L 33/44 (2010.01); H01L 31/18 (2006.01); H01L 31/0216 (2014.01);
U.S. Cl.
CPC ...
H01L 31/12 (2013.01); H01L 31/0203 (2013.01); H01L 31/02164 (2013.01); H01L 31/18 (2013.01); H01L 33/44 (2013.01); H01L 33/52 (2013.01); H01L 33/58 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0025 (2013.01);
Abstract

A manufacturing method of an optical module is provided and includes: attaching a light emitting diode light emitting device and a sensor on a substrate; disposing a first encapsulation portion on the light emitting device and the substrate; disposing a second encapsulation portion on the sensor and the substrate; disposing a shielding layer on the first encapsulation portion, the second encapsulation portion and the substrate; removing a first portion of the first encapsulation portion, a second portion of the second encapsulation portion, and a third portion of the shielding layer, and the first portion corresponds to a position of the light emitting device, the second portion corresponds to a position of the sensor, and the third portion corresponds to the positions of the light emitting device and the sensor; and forming a third encapsulation layer on the shielding layer, the first encapsulation portion and the second encapsulation portion.


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