The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2021

Filed:

Dec. 30, 2018
Applicant:

Ningbo Semiconductor International Corporation, Ningbo, CN;

Inventor:

Mengbin Liu, Ningbo, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); B81C 99/00 (2010.01); H01L 21/78 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); B81C 99/007 (2013.01); H01L 21/67282 (2013.01); H01L 21/78 (2013.01); B81C 2203/054 (2013.01); H01L 2223/54426 (2013.01);
Abstract

An alignment mark, a semiconductor device, and fabrication methods of the alignment mark and the semiconductor device are provided. The method includes providing a first base substrate, and forming a plurality of alignment marks on the first base substrate. The method also includes dicing the first base substrate to form a plurality of alignment dies. Each alignment die includes a diced first base substrate and at least one alignment mark diced from the plurality of alignment marks on the diced first base substrate. In addition, the method includes providing a second base substrate for aligning, and forming a bonding film on the second base substrate. Further, the method includes attaching an alignment die of the plurality of alignment dies to the bonding film on an alignment region of the second base substrate using a die attach process.


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