The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2021

Filed:

Aug. 07, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Lara Hawrylchak, Gilroy, CA (US);

Kin Pong Lo, Fremont, CA (US);

Errol C. Sanchez, Tracy, CA (US);

Schubert S. Chu, San Francisco, CA (US);

Tushar Mandrekar, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/18 (2006.01); H01L 21/02 (2006.01); C23C 16/02 (2006.01); B08B 7/00 (2006.01); H01L 21/67 (2006.01); H01J 37/32 (2006.01); H01L 21/687 (2006.01); C30B 25/02 (2006.01); C23C 16/54 (2006.01); C30B 33/08 (2006.01); C23C 16/24 (2006.01); C23C 16/46 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02658 (2013.01); B08B 7/0035 (2013.01); C23C 16/0236 (2013.01); C23C 16/0245 (2013.01); C23C 16/24 (2013.01); C23C 16/46 (2013.01); C23C 16/54 (2013.01); C30B 25/02 (2013.01); C30B 33/08 (2013.01); H01J 37/32357 (2013.01); H01J 37/32724 (2013.01); H01J 37/32899 (2013.01); H01L 21/02046 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02532 (2013.01); H01L 21/67028 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/67115 (2013.01); H01L 21/67167 (2013.01); H01L 21/67184 (2013.01); H01L 21/67207 (2013.01); H01L 21/67248 (2013.01); H01L 21/68742 (2013.01); H01L 21/68785 (2013.01); H01L 21/68792 (2013.01); H01J 37/321 (2013.01); H01J 37/32091 (2013.01); H01J 2237/002 (2013.01); H01J 2237/335 (2013.01); H01L 21/02049 (2013.01); H01L 21/0254 (2013.01); H01L 21/02546 (2013.01);
Abstract

In one implementation, a processing system includes a first transfer chamber coupling to at least one epitaxy process chamber, a second transfer chamber, a transition station disposed between the first transfer chamber and the second transfer chamber, a first plasma chamber coupled to the second transfer chamber for removing oxides from a surface of a substrate, and a load lock chamber coupled to the second transfer chamber. The transition station connects to the first transfer chamber and the second transfer chamber, and the transition station includes a second plasma chamber for removing contaminants from the surface of the substrate.


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