The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2021
Filed:
Oct. 14, 2016
Dowa Metaltech Co., Ltd., Tokyo, JP;
DOWA METALTECH CO., LTD., Tokyo, JP;
Abstract
A copper alloy sheet material that is excellent in surface smoothness of an etched surface has a composition containing, (mass %), from 1.0 to 4.5% of Ni, from 0.1 to 1.2% of Si, from 0 to 0.3% of Mg, from 0 to 0.2% of Cr, from 0 to 2.0% of Co, from 0 to 0.1% of P, from 0 to 0.05% of B, from 0 to 0.2% of Mn, from 0 to 0.5% of Sn, from 0 to 0.5% of Ti, from 0 to 0.2% of Zr, from 0 to 0.2% of Al, from 0 to 0.3% of Fe, from 0 to 1.0% of Zn, the balance Cu and unavoidable impurities. A number density of coarse secondary phase particles has a major diameter of 1.0 μm or more of 4.0×10per square millimeter or less. KAM value measured with a step size of 0.5 μm is more than 3.00.