The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2021

Filed:

Mar. 22, 2018
Applicant:

Ansys, Inc., Canonsburg, PA (US);

Inventors:

John Lee, San Jose, CA (US);

Aveek Sarkar, Palo Alto, CA (US);

Altan Odabasi, Canonsburg, PA (US);

Scott Johnson, Canonsburg, PA (US);

Murat Becer, Canonsburg, PA (US);

William Mullen, Canonsburg, PA (US);

Assignee:

Ansys, Inc., Canonsburg, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/367 (2020.01);
U.S. Cl.
CPC ...
G06F 30/367 (2020.01);
Abstract

A chip package system comprising N multiple processor cores can be tested by receiving a data file characterizing the chip package system. Thereafter, simulation testing is conducted for each core for each of Mstates using the data file such that each core is active in each state while all other cores are inactive. Each simulation test results in a simulation. The simulations are then combined to result in a composite test covering Mcombinations. Related apparatus, systems, techniques and articles are also described.


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