The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2021

Filed:

May. 28, 2019
Applicant:

Xcerra Corporation, Norwood, MA (US);

Inventors:

Valts Treibergs, St. Paul, MN (US);

Mitchell Nelson, St. Paul, MN (US);

Assignee:

XCERRA CORPORATION, Norwood, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 1/06727 (2013.01); G01R 1/06722 (2013.01); G01R 1/07307 (2013.01); G01R 31/2831 (2013.01);
Abstract

A hybrid probe head assembly for testing a wafer device under test includes a housing, at least a portion of a lead frame assembly disposed in the housing, the lead frame assembly including a at least one cantilever portion, the at least one cantilever portion including an undeflected position and a deflected position, where the lead frame assembly hinges between the undeflected position and the deflected position at a lead frame pivot point, and the at least one cantilever portion extends to a wafer contact. In the undeflected position, the at least one cantilever portion is disposed at a 8-12 degree angle, and in the deflected position, the at least one cantilever portion is disposed at a 2-4 degree angle. One or more spring probes are disposed within the housing and have a wafer contact tip.


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