The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Apr. 26, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Heng Wu, Guilderland, NY (US);

Gen Tsutsui, Glenmont, NY (US);

Tenko Yamashita, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 21/762 (2006.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/76251 (2013.01); H01L 25/074 (2013.01); H01L 25/50 (2013.01);
Abstract

A semiconductor device structure and method for fabricating the same. The semiconductor device structure includes a first vertical transport field effect transistor (VTFET) comprising a first semiconductor fin and a second VTFET stacked on the first VTFET. The second VTFET includes a second semiconductor fin that is separate and distinct from the first semiconductor fin. At least one insulating layer is disposed on a top surface of the first VTFET. The second VTFET is disposed on the at least one insulating layer. The method includes forming a first vertical VTFET on a first substrate and bonding a second substrate to and on top of the first VTFET. A second VTFET is formed on the second substrate.


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