The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Oct. 02, 2019
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventor:

Markus Leitgeb, Trofaiach, AT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 25/04 (2014.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/4857 (2013.01); H01L 21/568 (2013.01); H01L 23/367 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 25/042 (2013.01); H01L 25/0655 (2013.01); H01L 25/072 (2013.01); H01L 25/0753 (2013.01); H01L 2224/023 (2013.01);
Abstract

A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a first component embedded in the stack, having at least one first pad on a bottom surface of the first component. The at least one first pad is electrically connected with a bottom surface of the stack. A second component embedded in the stack, having at least one second pad on a top surface of the second component. The at least one second pad is electrically connected with a top surface of the stack. The stack includes a first redistribution structure electrically connecting the at least one first pad of the first component with the bottom surface of the stack, and a second redistribution structure electrically connecting the at least one second pad of the second component with the top surface of the stack.


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