The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Jun. 28, 2019
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Yao-Hsien Chung, Kaohsiung, TW;

Hao-Hsuan Chang, Kaohsiung, TW;

Ting-An Chien, Tainan, TW;

Bin-Siang Tsai, Changhua County, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01); H01L 21/8234 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823468 (2013.01); H01L 21/823431 (2013.01); H01L 21/823437 (2013.01); H01L 29/4236 (2013.01); H01L 29/6653 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01);
Abstract

A method for forming a semiconductor device is provided. A dielectric layer is formed on a substrate. First and second gate trenches are formed in the dielectric layer. First and second spacers are disposed in the first and the second gate trenches, respectively. A patterned photoresist is formed on the dielectric layer. The patterned photoresist masks the first region and exposes the second region. Multiple cycles of spacer trimming process are performed to trim a sidewall profile of the second spacer. Each cycle comprises a step of oxygen stripping and a successive step of chemical oxide removal. The patterned photoresist is then removed to reveal the first region.


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