The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Feb. 06, 2019
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Kwang-Nam Kim, Suwon-si, KR;

Sung-Yeon Kim, Jeongeup-si, KR;

Hyung-Jun Kim, Suwon-si, KR;

Jong-Woo Sun, Hwaseong-si, KR;

Sang-Rok Oh, Yongin-si, KR;

Jung-Pyo Hong, Gwangmyeong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32697 (2013.01); H01J 37/3244 (2013.01); H01J 37/32183 (2013.01); H01J 37/32715 (2013.01); H01L 21/6833 (2013.01); H01J 37/3211 (2013.01); H01J 2237/334 (2013.01); H01L 21/67069 (2013.01);
Abstract

A substrate support apparatus includes a substrate stage to support a substrate, and a ground ring assembly along a circumference of the substrate stage, the ground ring assembly including a ground ring body, the ground ring body having a plurality of recesses along a circumferential portion thereof, and a plurality of ground blocks movable to be received into respective recesses of the plurality of recesses, the plurality of ground blocks including a conductive material to be electrically grounded.


Find Patent Forward Citations

Quick Actions:

Kim, Kwang-Nam. (2021). Substrate support apparatus and plasma processing apparatus having the same (U.S. Patent No. 11037766). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11037766

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