The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
Jul. 05, 2017
Macdermid Enthone Inc., Waterbury, CT (US);
John Commander, Old Saybrook, CT (US);
Kyle Whitten, Hamden, CT (US);
Vincent Paneccasio, Jr., Madison, CT (US);
Shaopeng Sun, Orange, CT (US);
Eric Yakobson, Cheshire, CT (US);
Jianwen Han, Waterbury, CT (US);
Elie Najjar, Norwood, MA (US);
MacDermid Enthone Inc., Waterbury, CT (US);
Abstract
Compositions and methods of using such compositions for electroplating cobalt onto semiconductor base structures comprising submicron-sized electrical interconnect features are provided herein. The interconnect features are metallized by contacting the semiconductor base structure with an electrolytic composition comprising a source of cobalt ions, a suppressor, a buffer, and one or more of a depolarizing compound and a uniformity enhancer. Electrical current is supplied to the electrolytic composition to deposit cobalt onto the base structure and fill the submicron-sized features with cobalt. The method presented herein is useful for superfilling interconnect features.