The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Apr. 20, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chia-Yang Wu, Tainan, TW;

Shiu-Ko Jangjian, Tainan, TW;

Ting-Chun Wang, Tainan, TW;

Yung-Si Yu, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/417 (2006.01); H01L 29/78 (2006.01); H01L 21/768 (2006.01); H01L 21/762 (2006.01); H01L 21/285 (2006.01); H01L 29/49 (2006.01); H01L 29/165 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66795 (2013.01); H01L 21/28556 (2013.01); H01L 21/762 (2013.01); H01L 21/76831 (2013.01); H01L 21/76832 (2013.01); H01L 21/76843 (2013.01); H01L 29/41791 (2013.01); H01L 29/4966 (2013.01); H01L 29/665 (2013.01); H01L 29/66545 (2013.01); H01L 29/7848 (2013.01); H01L 29/7851 (2013.01); H01L 21/76224 (2013.01); H01L 29/165 (2013.01);
Abstract

A semiconductor device structure is provided. The semiconductor device structure includes a transistor over a substrate. The semiconductor device structure includes a dielectric structure over the substrate and covering the transistor. The semiconductor device structure includes a contact structure passing through the dielectric structure and electrically connected to the transistor. The contact structure includes a contact layer, a first barrier layer, and a second barrier layer, the first barrier layer surrounds the contact layer, the second barrier layer surrounds a first upper portion of the first barrier layer, a first lower portion of the first barrier layer is in direct contact with the dielectric structure, and a thickness of the first lower portion increases toward the substrate.


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