The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

May. 30, 2019
Applicant:

Sandisk Technologies Llc, Addison, TX (US);

Inventors:

Seungpil Lee, San Ramon, CA (US);

Kwang-Ho Kim, Pleasanton, CA (US);

Assignee:

SanDisk Technologies LLC, Addison, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 21/66 (2006.01); H01L 27/11582 (2017.01); H01L 25/00 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); G01R 31/50 (2020.01);
U.S. Cl.
CPC ...
H01L 22/34 (2013.01); G01R 31/50 (2020.01); H01L 21/78 (2013.01); H01L 22/20 (2013.01); H01L 22/32 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/89 (2013.01); H01L 24/94 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 27/11582 (2013.01); H01L 2224/06515 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80121 (2013.01); H01L 2224/80908 (2013.01);
Abstract

A first workpiece includes first active pads, a first test pad, and a second test pad on a primary surface of the first workpiece, the first test pad electrically connected to the second test pad. A second workpiece includes second active pads, a third test pad, and a fourth test pad on a primary surface of the second workpiece. The first and second workpieces are bonded along an interface between the primary surface of the first workpiece and the primary surface of the second workpiece to bond the first active pads with the second active pads, bond the first test pad with the third test pad, and bond the second test pad with the fourth test pad. Connectivity detection circuits test electrical connectivity between the third test pad and the fourth test pad.


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