The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Aug. 29, 2019
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Mayumi Kusakawa, Tokyo, JP;

Yukiyasu Masuda, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H01L 21/68 (2006.01); H01L 21/67 (2006.01); B23K 37/04 (2006.01); B23K 26/03 (2006.01); B23K 26/08 (2014.01); H01L 21/304 (2006.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68735 (2013.01); B23K 26/032 (2013.01); B23K 26/0853 (2013.01); B23K 37/04 (2013.01); G01N 21/9503 (2013.01); H01L 21/304 (2013.01); H01L 21/67092 (2013.01); H01L 21/67259 (2013.01); H01L 21/681 (2013.01);
Abstract

A processing apparatus includes a holding table. The holding table includes a frustoconical portion and a wafer holding portion formed on the upper surface of the frustoconical portion for holding the wafer. Light is applied from a light emitting member to the side surface of the frustoconical portion and next reflected on the side surface of the frustoconical portion. The light reflected is applied to the outer circumference of the wafer held on the wafer holding portion of the holding table to thereby image the outer circumference of the wafer by an imaging unit.


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