The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Mar. 07, 2019
Applicant:

Fujitsu Limited, Kawasaki, JP;

Inventor:

Kozo Makiyama, Kawasaki, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/778 (2006.01); H01L 29/20 (2006.01); H01L 29/423 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7783 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01); H01L 29/2003 (2013.01); H01L 29/41766 (2013.01); H01L 29/42376 (2013.01);
Abstract

A nitride semiconductor device includes a first nitride semiconductor layer; a back-barrier layer that contains InGaN provided on the first nitride semiconductor layer; and a second nitride semiconductor layer that is provided on the back-barrier layer, wherein, in the back-barrier layer, in a thickness direction, an In composition increases at a first interface with the first nitride semiconductor layer, and the In composition is continuously reduced toward a second interface with the second nitride semiconductor layer.


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Makiyama, Kozo. (2021). Nitride semiconductor device and manufacturing method for the same (U.S. Patent No. 11024730). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11024730

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