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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11024638 B1

PDFFull Text
Date of Patent:
Jun. 01, 2021

Filed:

May. 22, 2019

Three-dimensional semiconductor device

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sun Il Shim, Seoul, KR;

Kyung Dong Kim, Hwaseong-si, KR;

Ju Hak Song, Hwaseong-si, KR;

Jee Hoon Han, Hwaseong-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Attorney:

Lee IP Law, PC

Primary Examiner:

Nathan W Ha

Int. Cl.
CPC ...
H01L 27/1157 (2017.01); H01L 27/11578 (2017.01); H01L 27/11551 (2017.01); H01L 27/11521 (2017.01); H01L 27/11529 (2017.01); H01L 27/11573 (2017.01);
U.S. Cl.
CPC ...
H01L 27/1157 (2013.01); H01L 27/11521 (2013.01); H01L 27/11529 (2013.01); H01L 27/11551 (2013.01); H01L 27/11573 (2013.01); H01L 27/11578 (2013.01);
Abstract

A three-dimensional semiconductor device includes a first substrate, a second substrate on the first substrate, the second substrate including pattern portions and a plate portion covering the pattern portions, the plate portion having a width greater than a width of each of the pattern portions and being connected to the pattern portions, a lower structure between the first substrate and the second substrate, horizontal conductive patterns on the second substrate, the horizontal conductive patterns being stacked while being spaced apart from each other in a direction perpendicular to an upper surface of the second substrate, and a vertical structure on the second substrate and having a side surface opposing the horizontal conductive patterns.

Find Patent Forward Citations

Shim, Sun. (2021). Three-dimensional semiconductor device (U.S. Patent No. 11024638). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11024638

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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