The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Oct. 15, 2019
Applicant:
Renesas Electronics Corporation, Tokyo, JP;
Inventors:
Shinichi Uchida, Tokyo, JP;
Akio Ono, Ibaraki, JP;
Shinichi Kuwabara, Ibaraki, JP;
Yasutaka Nakashiba, Ibaraki, JP;
Assignee:
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/522 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49558 (2013.01); H01L 23/3107 (2013.01); H01L 23/49548 (2013.01); H01L 23/49586 (2013.01); H01L 23/5227 (2013.01); H01L 23/645 (2013.01); H01L 24/31 (2013.01); H01L 24/46 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 2224/73151 (2013.01);
Abstract
A first semiconductor chip and a second semiconductor chip are stacked such that a first inductor and a second inductor face each other. An insulating sheet is disposed between the first semiconductor chip and the second semiconductor chip. The sealing member seals the first semiconductor chip, the second semiconductor chip, and the insulating sheet. The sealing member is disposed both between the insulating sheet and the first semiconductor chip and between the insulating sheet and the second semiconductor chip.