The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Mar. 09, 2020
Applicants:

SK Hynix Inc., Icheon, KR;

Industry-university Cooperation Foundation Hanyang University, Seoul, KR;

Inventors:

Seung Jae Moon, Seoul, KR;

Jung Ho Yun, Suwon, KR;

Jong Jin Hwang, Seoul, KR;

Cheong Il Ryu, Hwaseong, KR;

Sung Mook Jung, Yongin, KR;

Mun Hyeong Jegal, Yongin, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 11/06 (2006.01);
U.S. Cl.
CPC ...
G01B 11/0625 (2013.01); G01B 11/0633 (2013.01); G01B 11/0683 (2013.01); G01B 2210/56 (2013.01);
Abstract

A thickness measuring device includes a laser emitting a laser beam to an object in a semiconductor processing chamber, a quartz glass inside the chamber reflecting part of the laser beam and to transmit a remainder of the laser beam, a first light receiving sensor detecting an intensity of first reflected light reflected from the quartz glass, a second light receiving sensor detecting an intensity of second reflected light transmitted through the quartz glass and reflected from the object, and a controller configured to calculate input intensity of the laser beam based on the intensity of the first reflected light, to calculate reflectivity of the object by comparing the input intensity of the laser beam with the intensity of the second reflected light, and to measure a thickness of the object by comparing the calculated reflectivity with predetermined reflectivity values for a plurality of thicknesses.


Find Patent Forward Citations

Moon, Seung. (2021). Device and method for measuring thickness (U.S. Patent No. 11022427). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11022427

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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