The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Sep. 23, 2016
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Jung Hak Kim, Daejeon, KR;
Hee Jung Kim, Daejeon, KR;
Se Ra Kim, Daejeon, KR;
Kwang Joo Lee, Daejeon, KR;
Young Kook Kim, Daejeon, KR;
Seung Hee Nam, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/10 (2006.01); C09J 7/10 (2018.01); C09J 133/04 (2006.01); C08G 59/62 (2006.01); H01L 25/07 (2006.01); H01L 25/065 (2006.01); H01L 23/482 (2006.01); H01L 23/00 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C09J 7/10 (2018.01); C08G 59/621 (2013.01); C09J 133/04 (2013.01); C09J 163/00 (2013.01); C09J 163/10 (2013.01); H01L 23/482 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/91 (2013.01); H01L 25/065 (2013.01); H01L 25/07 (2013.01); C09J 2203/326 (2013.01); C09J 2301/312 (2020.08); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/83203 (2013.01); H01L 2924/0635 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/3511 (2013.01);
Abstract
The present invention relates to an adhesive film having a thixotropic index at 110° C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.