The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Mar. 19, 2019
Ev Group E. Thallner Gmbh, St. Florian am Inn, AT;
Thomas Wagenleitner, Aurolzmunster, AT;
Markus Wimplinger, Ried im Innkreis, AT;
Friedrich Paul Lindner, Scharding, AT;
Thomas Plach, Linz, AT;
Florian Kurz, Taufkirchen an der Pram, AT;
EV Group E. Thallner GmbH, St. Florian am Inn, AT;
Abstract
A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.