The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Jul. 24, 2020
Shinko Electric Industries Co., Ltd., Nagano-ken, JP;
Yasuyuki Yamaguchi, Nagano, JP;
Abstract
A wiring substrate includes a first insulation layer, a second insulation layer formed on an upper surface of the first insulation layer, an opening extending through the second insulation layer, an adhesive layer formed on a bottom surface in the opening, an electronic component fixed in the opening by the adhesive layer, a filling insulation layer covering an upper surface of the second insulation layer and filling the opening to cover the electronic component, and a wiring layer formed on an upper surface of the filling insulation layer. The adhesive layer includes a base portion covering a lower surface of the electronic component in tight contact and a cover portion covering a side surface of the electronic component in tight contact. The cover portion has a lower filler content ratio than the base portion. The filling insulation layer covers a side surface of the cover portion in tight contact.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile