The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Jun. 21, 2019
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Kenichi Mori, Nagano, JP;

Yoshihiro Kita, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H05K 1/0218 (2013.01); H05K 1/115 (2013.01); H05K 3/0032 (2013.01); H05K 3/0055 (2013.01); H05K 3/4038 (2013.01); H05K 3/4644 (2013.01); H05K 1/0278 (2013.01); H05K 1/18 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09827 (2013.01); H05K 2203/107 (2013.01);
Abstract

A wiring substrate includes a plurality of wiring layers, a component mounting part on which an electronic component can be mounted, and a component non-mounting part on which an electronic component cannot be mounted. A portion located in the component non-mounting part of one wiring layer of the plurality of the wiring layers includes a plurality of first through-holes having an elongated shape as seen from above and aligned with predetermined intervals with longitudinal directions of the first through-holes being faced toward a direction perpendicular to a longitudinal direction of the wiring substrate.


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