The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Jun. 24, 2019
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventors:

Seungkee Min, Chandler, AZ (US);

Margaret A. Szymanowski, Chandler, AZ (US);

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/68 (2006.01); H03F 1/02 (2006.01); H01L 23/528 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 27/02 (2006.01); H01L 27/06 (2006.01); H01L 49/02 (2006.01); H03F 1/56 (2006.01); H03F 3/213 (2006.01);
U.S. Cl.
CPC ...
H03F 1/0288 (2013.01); H01L 23/528 (2013.01); H01L 23/66 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 27/0207 (2013.01); H01L 27/0629 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01); H03F 1/565 (2013.01); H03F 3/213 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48108 (2013.01); H01L 2224/48153 (2013.01); H03F 2200/318 (2013.01); H03F 2200/423 (2013.01); H03F 2200/451 (2013.01); H03F 2200/552 (2013.01);
Abstract

A multiple-path amplifier (e.g., a Doherty amplifier) includes a first transistor (e.g., a main amplifier FET), a second transistor (e.g., a peaking amplifier FET), a combining node, and a shunt-inductance circuit. The first and second amplifiers and the combining node structure are integrally-formed with a semiconductor die, and the shunt-inductance circuit is integrated with the die. Outputs of the first and second transistors are electrically coupled to the combining node structure. The shunt-inductance circuit is electrically coupled between the combining node structure and a ground reference node. The shunt-inductance circuit includes a shunt inductance (e.g., including wirebond(s) and/or spiral inductor(s)) that is integrated with the semiconductor die. The multiple-path amplifier also may include an integrated phase shifter/impedance inverter coupled between the outputs of the first and second transistors, and which is configured to impart a 90-degree phase delay between intrinsic drains of the first and second transistors.


Find Patent Forward Citations

Min, Seungkee. (2021). Integrated multiple-path power amplifier (U.S. Patent No. 11018629). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11018629

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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