The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Nov. 22, 2019
Applicant:

Yangtze Memory Technologies Co., Ltd., Wuhan, CN;

Inventor:

Gang Yang, Wuhan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/027 (2006.01); H01L 21/033 (2006.01); H01L 21/311 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76816 (2013.01); H01L 21/0273 (2013.01); H01L 21/0332 (2013.01); H01L 21/0334 (2013.01); H01L 21/0337 (2013.01); H01L 21/0338 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/76804 (2013.01); H01L 21/76811 (2013.01); H01L 21/76831 (2013.01); H01L 21/76843 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01);
Abstract

A method for fabricating a semiconductor device that includes forming a mask stack over a semiconductor structure. The mask stack has a first mask layer and a second mask layer, where the second mask layer is arranged between the first mask layer and the semiconductor structure. The method further includes patterning a first pattern in the mask stack. The first pattern includes a first opening having first sidewalls formed in the first mask layer, a second opening having second sidewalls formed in the second mask layer, and a third opening having third sidewalls formed in the semiconductor structure. The first, second, and third sidewalls of the respective openings of the first pattern are formed around a central axis, where the second sidewalls of the second opening are located further away from the central axis than both the first and third sidewalls of the first and third openings, respectively.


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