The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Aug. 02, 2018
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventors:

Trent Uehling, New Braunfels, TX (US);

Chee Seng Foong, Austin, TX (US);

Assignee:

NXP USA, INC., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/027 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); H01L 21/0273 (2013.01); H01L 21/481 (2013.01); H01L 21/486 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/562 (2013.01);
Abstract

Embodiments are provided herein for a substrate having one or more embedded traces and a method for fabricating one or more embedded traces. The method includes: forming a bump on a first major surface of a substrate, the bump having a height measured from the first major surface to a top surface of the bump; forming a trace comprising: a lower trace portion that directly contacts the first major surface, a sidewall trace portion that directly contacts at least one sidewall of the bump, and an upper trace portion that directly contacts the top surface of the bump; depositing a blanket dielectric layer over the trace; and etching away a top portion of the blanket dielectric layer to expose a top surface of the upper trace portion.


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