The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Sep. 28, 2019
Applicant:
Winbond Electronics Corp., Taichung, TW;
Inventor:
Yi-Chung Chen, Taichung, TW;
Assignee:
Winbond Electronics Corp., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/321 (2006.01); H01L 21/3105 (2006.01); C09K 13/02 (2006.01); C09K 13/00 (2006.01); C09G 1/02 (2006.01); B24B 37/24 (2012.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); C09G 1/02 (2013.01); C09K 13/00 (2013.01); C09K 13/02 (2013.01); H01L 21/31053 (2013.01); H01L 21/3212 (2013.01);
Abstract
Provided is a chemical mechanical polishing process. The process includes the following steps: a layer to be polished is provided, wherein the layer to be polished has a hole, a trench and/or an opening formed therein, and a protrusion is formed at the corner of the top of the hole, the trench and/or the opening; a polishing pad with a plurality of fibers on the surface thereof is provided; and in a moving direction perpendicular to the top surface of the layer to be polished, the plurality of fibers of the polishing pad are intermittently contacted with the protrusion in the presence of an abrasive-free slurry.