The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Aug. 07, 2017
Mitsubishi Materials Corporation, Tokyo, JP;
Akihiro Murakami, Tokyo, JP;
Hitoshi Kunugi, Tokyo, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
In the surface-coated cutting tool, a Ti compound layer containing at least nitrogen and carbon is formed on a surface of cutting tool substrate, a nitrogen concentration in the Ti compound layer, in a case of being measured in a direction perpendicular to the surface of the cutting tool substrate in a vicinity of a cutting edge, gradually increases as a distance from cutting tool substrate increases within a range of 0.20 μm from the surface of the cutting tool substrate toward the Ti compound layer, an average concentration gradient of the nitrogen concentration is 20 at %/μm or more and 300 at %/μm or less, and an average nitrogen concentration in the Ti compound layer in the vicinity of the cutting edge is lower than an average nitrogen concentration in the Ti compound layer at a position of a flank face away from the cutting edge by 3 at % or more.