The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

Jun. 04, 2019
Applicants:

Te Connectivity India Private Limited, Bangalore, IN;

Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;

Te Connectivity Corporation, Berwyn, PA (US);

Inventors:

Sheng Li, Shanghai, CN;

Kurt Allen Randolph, Etters, PA (US);

P. K. Senthil Kumar, Bengaluru, IN;

Yongjian Huang, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/18 (2006.01); H01R 4/20 (2006.01); H01R 4/2495 (2018.01); H01R 43/048 (2006.01);
U.S. Cl.
CPC ...
H01R 4/184 (2013.01); H01R 4/206 (2013.01); H01R 4/2495 (2013.01); H01R 43/048 (2013.01);
Abstract

A multiple bussed termination for connecting a plurality of wires comprises a plurality of splices each having a base and a region for holding some of the plurality of wires. The splices are connected to each other by a conductive strip extending from the base of a first splice of the plurality of splices to a remainder of the plurality of splices. The splices are each capable of being crimped to some of the plurality of wires.


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