The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

Apr. 22, 2020
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Tasuku Koyanagi, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/0093 (2020.05); H01L 25/0753 (2013.01);
Abstract

A transferring method of transferring a plurality of optical device layers includes a transfer member bonding step, a buffer layer breaking step, a first optical device layer transferring step, an adhesive removing step, and a second optical device layer transferring step. In the transfer member bonding step, an optical device wafer and a transfer member are bonded to each other through an adhesive, and each spacing between adjacent ones of the optical device layers of the optical device wafer which each have been divided in a chip size is filled with the adhesive. In the adhesive removing step, at least part of the adhesive with which each spacing between the adjacent ones of the optical device layers has been filled is removed such that the optical device layers which have been embedded in an adhesive layer in the transfer member bonding step project from the adhesive layer.


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