The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2021
Filed:
Nov. 20, 2018
Applicant:
Asm Technology Singapore Pte Ltd, Singapore, SG;
Inventors:
Assignee:
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01C 3/08 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); G01B 11/06 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); G01B 11/06 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); G01B 2210/56 (2013.01); H01L 23/3185 (2013.01); H01L 2224/759 (2013.01); H01L 2224/83908 (2013.01);
Abstract
An apparatus for inspecting a semiconductor die bonded on a top surface of a substrate uses an optical assembly including an image sensor and an optical system for conducting the inspection. The optical assembly is tilted at an oblique angle with respect to the top surface of the substrate, and is arranged such that its depth of focus is substantially perpendicular to the top surface of the substrate for inspecting at least one side wall of the semiconductor die.