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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11007722 B1

PDFFull Text
Date of Patent:
May. 18, 2021

Filed:

Oct. 18, 2017

Dielectric-heating bonding film and joining method using dielectric-heating bonding film

Applicant:

Lintec Corporation, Tokyo, JP;

Inventors:

Masakazu Ishikawa, Tokyo, JP;

Tatsuya Izumi, Tokyo, JP;

Assignee:

LINTEC CORPORATION, Tokyo, JP;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Daniel McNally

Int. Cl.
CPC ...
C09J 11/04 (2006.01); B29C 65/04 (2006.01); B29C 65/42 (2006.01); B29C 65/50 (2006.01); C08K 3/22 (2006.01); C09J 123/26 (2006.01); C09J 129/14 (2006.01); C09J 131/04 (2006.01); C09J 167/00 (2006.01); C09J 177/00 (2006.01); H05B 6/46 (2006.01); B29C 65/40 (2006.01); C09J 123/00 (2006.01); C09J 125/04 (2006.01); H05B 6/64 (2006.01); C09J 7/00 (2018.01); C09J 201/00 (2006.01); C09J 123/10 (2006.01); C09J 7/35 (2018.01); C09J 5/06 (2006.01); C09J 9/00 (2006.01); H01B 3/44 (2006.01); H01B 17/56 (2006.01); H05B 6/50 (2006.01); C08K 3/14 (2006.01);
U.S. Cl.
CPC ...
B29C 65/04 (2013.01); B29C 65/40 (2013.01); B29C 65/425 (2013.01); B29C 65/50 (2013.01); C08K 3/22 (2013.01); C09J 5/06 (2013.01); C09J 7/00 (2013.01); C09J 7/35 (2018.01); C09J 9/00 (2013.01); C09J 11/04 (2013.01); C09J 123/00 (2013.01); C09J 123/10 (2013.01); C09J 123/26 (2013.01); C09J 125/04 (2013.01); C09J 129/14 (2013.01); C09J 131/04 (2013.01); C09J 167/00 (2013.01); C09J 177/00 (2013.01); C09J 201/00 (2013.01); H01B 3/441 (2013.01); H01B 17/56 (2013.01); H05B 6/46 (2013.01); H05B 6/50 (2013.01); H05B 6/64 (2013.01); C08K 3/14 (2013.01); C08K 2003/2296 (2013.01); C08K 2201/005 (2013.01); C09J 2203/326 (2013.01); C09J 2301/408 (2020.08); C09J 2301/416 (2020.08); C09J 2423/10 (2013.01);
Abstract

A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 μm, a thickness of the dielectric welding film ranging from 10 to 2,000 μm. The method uses the dielectric welding film.

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