The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Oct. 21, 2019
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sang-Su Park, Seoul, KR;

Kwansik Kim, Seoul, KR;

Yoonkyoung Kim, Seoul, KR;

Changhwa Kim, Hwaseong-si, KR;

Mangeun Cho, Suwon-si, KR;

Hyungi Hong, Seongnam-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 21/762 (2006.01); H01L 21/223 (2006.01); H01L 21/225 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14698 (2013.01); H01L 21/2236 (2013.01); H01L 21/76227 (2013.01); H01L 21/2252 (2013.01); H01L 21/76237 (2013.01); H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 27/14683 (2013.01);
Abstract

A method of fabricating an image sensor is provided. The method includes comprises forming a deep trench in a semiconductor substrate, performing a first plasma doping process to form a first impurity region a portion of in the semiconductor substrate adjacent to inner sidewalls and a bottom surface of the deep trench, the first impurity region being doped with first impurities of a first conductivity type, and performing an annealing process to diffuse the first impurities from the first impurity region into the semiconductor substrate to form a photoelectric conversion part.


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